[National platform support, Xiong'an New District will be China's "Silicon Valley"? ] Recently, the General Office of the Hebei Provincial Government issued the "Implementation Opinions on Accelerating the Development of the Integrated Circuit Industry", proposing a batch of state-level innovation platforms for integrated circuits in the construction of the Xiong'an New District National Laboratory, National Key Laboratory, and Engineering Research Center. , strive to create a global integrated circuit innovation highland.
Provincial goals
By 2020, the average operating income of the integrated circuit industry in Hebei Province will grow at an average annual rate of more than 30%, and 5-10 IC upstream and downstream companies will be introduced, 3-5 IC design services and integrated circuits with leading domestic level will be nurtured. Special-purpose material companies, build 3-5 key laboratories above the provincial level, enterprise technology centers and other R & D platforms. Strive to build a global IC innovation highland, China's largest electronic special gas R & D and production base, with a clear demonstration of military and civilian integration of the integrated circuit industry base.
Implement integrated circuit industry cluster project
In Xiong'an New District, a number of national-level innovation platforms in the field of integrated circuits, including national laboratories, national key laboratories, and engineering research centers, will be deployed to create a global integrated circuit innovation highland. Shijiazhuang focused on the development of microwave integrated circuit design, radio frequency integrated circuit design, etc., to create a national leading integrated circuit design and manufacturing base. Encourage Shijiazhuang, Baoding, Langfang and other regions with favorable conditions to actively introduce domestic and international ASIC chip manufacturing, packaging and testing companies, undertake the incubating and transformation of scientific research achievements in Beijing and other places, and build an industrial chain for design, manufacture, and packaging testing of application-specific integrated circuits.
Implementing "solid-base" engineering of integrated circuit industry
Taking the development of high performance and green development as the main attack direction, we continued to increase the yield rate and market introduction rate. Accelerate the pace of technological transformation of basic materials, improve product technology and quality levels, and further consolidate the dominant position in the domestic market. To promote the development and industrialization of fifth-generation yttrium iron garnet crystal materials for mobile communications and to break the monopoly of foreign technology. Actively introduce and develop integrated circuit electronic materials such as high-end target materials, and continuously improve the supporting capabilities of the industry.
Implementing the "Strong Core" Project
Support the upgrading of existing dual-mode navigation receiver chips and other design standards, and promote the development of high-end, miniaturization, long life, and low power consumption. Promote the development and industrialization of the third-generation Beidou navigation high-precision chip, terahertz chip, and satellite mobile communication RF terminal chip. Leading chip design companies to develop and apply cooperation with complete companies in the areas of automotive, robotics, Internet of Things, and fifth-generation mobile communications to realize the application of independent chip industry scale.
Cultivate and develop special integrated circuit manufacturing
Supporting Specialized Integrated Circuits Advantages The company promotes the integrated development of chip design and manufacturing based on its own development needs. Renovate and upgrade the existing special-purpose production line and continue to expand production scale. Accelerate the research and development and industrialization of high-end sensors, MEMS devices and other products, and expand the power device and microwave integrated circuit industry. Carry out key equipment R&D and industrialization.
Introduce IC Packaging and Test Industry
Breakthrough the packaging technology bottleneck of high-voltage and high-power insulated gate bipolar transistor modules, promote the R&D and industrialization of ceramic parts precision manufacturing process, precision assembly process, etc., improve the level of conformity of package enclosures, and meet the fourth-generation and fifth-generation mobile communications need. Introduce a number of well-known IC packaging and testing companies at home and abroad, accelerate the development of production lines for chip testing, inspection, and packaging, promote the industrialization of IC packaging equipment and materials, and develop supporting capabilities that are compatible with the development of manufacturing and design links, and form clusters as soon as possible. Advantage.
Improve IC Technology Innovation Capabilities
Consolidate and upgrade the national level R&D and innovation platform for national engineering research centers for communication software and application-specific integrated circuit design, national key labs for gallium arsenide integrated circuits and power devices, and national and local joint engineering laboratories for high-density integrated circuit packaging technology. Support enterprises to strengthen cooperation with well-known scientific research institutes and enterprises in the field of integrated circuits at home and abroad, build research and development platforms such as key laboratories above the provincial level, and establish a technological innovation system that focuses on enterprises as the mainstay, market orientation, and deep integration of industry, university and research, and breaks through a batch of Core Technology.
Implementation of Military and Civil Integration Development Project
Accelerate the construction of a national-level demonstration base for new-type industrialization industry in the military and civilian (integration of civil and military) and Shijiazhuang Military and Civil Integration Industry Demonstration Park, actively promote “military transferâ€, accelerate the industrialization of civilian products in military research institutes in the province, and focus on advancing electronic special gas and micro-electromechanical systems ( The industrialization of scientific and technological achievements such as MEMS devices, high-end sensors, terahertz chips, and modules, as well as the application of the third-generation Beidou navigation and location service industry chain, has actively promoted micro-electromechanical system (MEMS) devices and high-end sensors in automotive electronics and industrial control. Application of the Internet of Things, smart city, smart city and other areas, the third generation of Beidou navigation in Xiong'an New District, 2022 Winter Olympic Games. Encourage the “military participation in the militaryâ€, support the development of military research and production tasks in the field of chip design, third-generation semiconductor materials and other fields with advanced technology, and build a military-civilian integration development base with a clear IC industry.
Shenzhen Kaixuanye Technology Co., Ltd. , https://www.icoilne.com