[Text|High-tech LED reporter Xu Chaopeng] The LED industry itself has always been an emerging market with “technology is everythingâ€. It is precisely because of the relentless pursuit of technology by many LED companies that it has contributed to such a grand scene in the current industry. Then, for the LED industry itself, for many industries involved in the upper, middle and lower reaches, the impact of technology on the LED supply chain is far-reaching and significant.
The 2014 High-tech LED Annual Meeting held on the morning of December 13th was held by Liyang Optoelectronics, the “Technology-Driven Supply Chain Transformation New Opportunity†sub-forum. Liu Ronghui, Director of Rare Earth Luminescence Department, Zhao Yutao, Chairman of Hyun Shuo Optoelectronics, Morning Mr. Qian Xuexing, General Manager of Science and Technology, Huang Huishi, Technical Director of Xinguanglian Semiconductor, Zhu Fan, General Manager of Hilde, Zhuo Weihuang, Technical Director of Huateng Semiconductor, and Lu Guoming, General Manager of Tengsheng Controlled Plastics, on the “supply chain under the new era of technology development†The theme of "Changes and Opportunities" was given and discussed with the guests attending the annual meeting.
Research rare earth Liu Ronghui: Domestic phosphor touch patent critical point "The domestic phosphor industry is still in the early stage of development, the future demand is definitely higher and higher. I think that the phosphor will maintain 30%-40% within three years. The growth rate." Liu Ronghui said that the concentration of LED phosphors in the future will be higher and higher, and to be bigger and stronger, we must pay attention to the quality and intellectual property of products.
In the field of patent subdivision, Liu Ronghui analyzed that aluminate phosphors, because the phosphor itself has no intellectual property problems, domestic and foreign technology and intellectual property innovation are very different, but it is still an irreplaceable product in the next few years. The silicate phosphor will be suitable for low- to medium-end backlight display, but will eventually be replaced by β-sialon:Eu phosphor.
At the same time, due to the immaturity of the NOx phosphor, it is urgent to develop a new system phosphor with independent intellectual property rights, which will drive the development of intellectual property and lead the market, and the white LED device will develop a new combination to meet Display (high light efficiency, wide color gamut) and lighting (high color rendering, low color temperature) applications.
Hyun Shuo Optoelectronics Zhao Yutao: Quality and service is the king of the company. “The packaging factory is a sandwich-like state. It is squeezed by the upstream and downstream. The packaging will move in two directions. First, horizontal and vertical integration, scale-up; The second is to extend to downstream lamps. In the future, manufacturers of packaging and lighting will reach a ratio of 3:7," said Zhao Yutao.
“Quality and service are the kings of the domestic package equipment enterprises.†Zhao Yutao emphasized that enterprises must prepare for “four steps†if they want to break through.
First, with product-driven channels, the growth of the enterprise must have a clear market positioning and product positioning. It is the only way to open the market with strong products. Second, to improve the brand with cost-effectiveness, companies do not have to be obsessed with branding. , technology, quality, service to meet customer needs; Third, to extend the product line by brand, the company to identify its own market positioning through the advantages of products + services; Fourth, capital integration products and brands, the power of enterprises through capital Do a good job in system marketing integration, provide customers with more value-added services and bring more solutions.
Morning Technology Money Snow: From Material to Solution "The current flip-chip process has four key points: First, material selection, selection of bonding materials according to wafer electrode material and positive and negative electrode spacing; Second, solid crystal operation, adjustment equipment Parameters; Third, the control of welding voids, including wafer back gold thickness, soldering temperature, time and solder paste formulation; Fourth, the residue response, involving no-cleaning and washing," Qian Xuexing said.
For the soldering process of the solid crystal solder paste, Qian Xuexing told everyone that for the packaging of the LED chip, the SnAgCuX alloy solder paste is used as the medium, and the chip and the solderable metal substrate such as gold, silver, tin, etc. are connected by high temperature. Fixing and cooling requirements.
At the same time, Qian Xuexing also mentioned a very important concept, namely fruit powder glue. It is understood that it is a combination of silica gel and phosphor powder to customize the color temperature and the standardized parameters of the index. When controlling the sizing parameters, a dispensing process is performed, which is a hemisphere or a straight shape. Its advantage is that it can achieve the color temperature of the module and the height of the index by the integrated package test.
“The LED flip-chip package uses fruit powder glue, the manufacturing process will become quite simple, and there are few related manufacturing equipments. Except for the solid crystal machine and the reflow furnace, the small equipment is small, and the occupied space is small, so that the LED light source manufacturing automation process height Integration. The next generation of fruit powder glue will be reflowed to make the manufacturing process streamlined and the automation set higher." Qian Xuexing finally mentioned.
Huang Hui-the new poem: Breakthrough Chip Technology Innovation <br> <br> price war with increasing drive current, the current chip inside, light and heat distribution tends to be centralized, high current drive, different product designs will As the temperature difference inside the chip reaches 30 ° C or more, the reliability of the gathering point is greatly reduced, which easily damages the product. Therefore, product technology improvement and innovation are essential to ensure product quality.
"The lower the performance of the luminaire, the higher the cost of the chip, the more the customer pays more attention to the price of the chip. However, as the chip size decreases, the profit margin is lower, and the small size chips on the market are mostly sold at a loss." Huang Huishi said.
Taking 4, 6 inch epitaxy as an example, with the decline of the price of sapphire substrate, the advantages of large-size substrate will gradually appear. It is expected that the share of 4-inch epitaxial wafer will reach 80% or more in the next 2 years. The mosaic, warpage and etch consistency of the 4-inch PSS substrate, as well as the uniformity of 4-inch epitaxial growth, warpage control and yield, are all urgent problems to be solved.
In order to gain market competitiveness, companies are also innovating in technology, but whether new technologies can be truly successful requires enterprise efforts. "New equipment and new technologies are opportunities and challenges for small enterprises. How to take advantage of the advantages of small enterprises to seize opportunities is worth considering." Huang Huishi finally said.
Hilde beans sail: grab the top spot in the sudden emergence of domestic phosphor <br> <br> In recent years, domestic enterprises through continuous development of LED phosphor, increase investment in production, its product quality and performance has been close to or exceeded imports phosphors In addition, the domestic LED phosphors have obvious cost-effective advantages and are constantly occupying the market share of international manufacturers.
"In terms of foreign phosphor brands, especially in the past three years, there has been a significant decline, and the market share of domestic phosphors will become higher and higher in the future." Bean Sails said at the scene.
“At the same time, LED phosphor companies are facing the same standards, patents, talents and capital chains as the packaging companies. I believe that there are several ways to solve this problem: First, focus on quality and brand building; Second, enhance innovation and the introduction of new fluorescent materials; Third, take the cooperation mode of domestic phosphor enterprises in the field of advantages, or cooperate with research institutions and important associations to break through the monopoly of the international giant patent alliance." Dou Fan mentioned.
Huateng semiconductor Zhuowei Huang: EMC test package is the trend <br> <br> packaging technology continues to mature, new technology emerging, EMC package as in recent years the rise of new technology, because of its good performance to be optimistic about a number of packaging companies.
"We expect that the market in 2015, whether it is EMC or EMC supporting products, will show explosive growth." Zhuo Weihuang said.
But like other new technologies, in the initial introduction stage, due to technical, market and cost constraints, only a few LED packaging manufacturers are in trial production. However, with the expansion of market demand and advances in technology, in particular, EMC stent molding materials also have the advantages of high stability against UV, high temperature, and low expansion coefficient. Therefore, bracket manufacturers and backlight markets at home and abroad gradually switch to EMC. Brackets, and this trend has also appeared to a large extent in the lighting market.
In addition, in the production process, many packaging manufacturers shoddy, use secondary recycling materials to fight the price war, completely regardless of product quality, and EMC has no water outlet sales. All kinds of advantages have made EMC's packaging form develop rapidly after its birth, and gradually extended from the initial backlight field to the white light market, and gradually gained market recognition.
Tengsheng Controlled Rubber Lu Guoming: Technology Innovation Drives New Space for Domestic Packaging Equipment “The LED packaging industry has a scale of 12.1 billion yuan in 2013, and is expected to reach more than 14.6 billion yuan in 2014. It is expected to reach 16.7 billion yuan in 2015. At the same time, current technology Packaging companies with obvious advantages in production capacity will benefit from the sharp increase in market demand, and will increase investment in large scale in the future.†Lu Guoming said that the competition between packaging companies will become more intense, so how to reduce costs and increase efficiency will become a solved problem.
Lu Guoming told everyone that the current packaging equipment's dispensing equipment has reached the equipment renewal cycle due to the development needs. Due to the high labor cost, large production line personnel, easy aging, low automation, etc., the dispensing equipment has been unable to adapt. The rapidly changing needs of the current packaging industry, therefore, investment in automated, high-performance fully automatic intelligent packaging dispensing equipment will be the general trend.
“And, the current production capacity of domestically produced equipment is more than 150% higher than that of imported similar equipment. At the same time, domestically produced equipment is slightly higher in automation function configuration than imported similar equipment, and is designed to better meet user needs, and equipment innovation is faster. Lu Guoming mentioned.
It is reported that after catching up in recent years, in addition to the stability of domestic packaging and dispensing equipment, the other indicators have completely replaced or even surpassed imported equipment. And since 2013, including foreign packaging companies CREE, SAMSUNG, LG, SEOUL, domestic listed companies Hongli, Ruifeng, Jufei, Guoxing, etc. have begun testing or using domestic packaging dispensing equipment.
"Therefore, we have reason to believe that with the rapid innovation and improvement of domestically produced equipment, it will lead the current market to a broader development path." Lu Guoming finally mentioned.
The 2014 High-tech LED Annual Meeting held on the morning of December 13th was held by Liyang Optoelectronics, the “Technology-Driven Supply Chain Transformation New Opportunity†sub-forum. Liu Ronghui, Director of Rare Earth Luminescence Department, Zhao Yutao, Chairman of Hyun Shuo Optoelectronics, Morning Mr. Qian Xuexing, General Manager of Science and Technology, Huang Huishi, Technical Director of Xinguanglian Semiconductor, Zhu Fan, General Manager of Hilde, Zhuo Weihuang, Technical Director of Huateng Semiconductor, and Lu Guoming, General Manager of Tengsheng Controlled Plastics, on the “supply chain under the new era of technology development†The theme of "Changes and Opportunities" was given and discussed with the guests attending the annual meeting.
Annual meeting forum
Research rare earth Liu Ronghui: Domestic phosphor touch patent critical point "The domestic phosphor industry is still in the early stage of development, the future demand is definitely higher and higher. I think that the phosphor will maintain 30%-40% within three years. The growth rate." Liu Ronghui said that the concentration of LED phosphors in the future will be higher and higher, and to be bigger and stronger, we must pay attention to the quality and intellectual property of products.
In the field of patent subdivision, Liu Ronghui analyzed that aluminate phosphors, because the phosphor itself has no intellectual property problems, domestic and foreign technology and intellectual property innovation are very different, but it is still an irreplaceable product in the next few years. The silicate phosphor will be suitable for low- to medium-end backlight display, but will eventually be replaced by β-sialon:Eu phosphor.
At the same time, due to the immaturity of the NOx phosphor, it is urgent to develop a new system phosphor with independent intellectual property rights, which will drive the development of intellectual property and lead the market, and the white LED device will develop a new combination to meet Display (high light efficiency, wide color gamut) and lighting (high color rendering, low color temperature) applications.
Hyun Shuo Optoelectronics Zhao Yutao: Quality and service is the king of the company. “The packaging factory is a sandwich-like state. It is squeezed by the upstream and downstream. The packaging will move in two directions. First, horizontal and vertical integration, scale-up; The second is to extend to downstream lamps. In the future, manufacturers of packaging and lighting will reach a ratio of 3:7," said Zhao Yutao.
“Quality and service are the kings of the domestic package equipment enterprises.†Zhao Yutao emphasized that enterprises must prepare for “four steps†if they want to break through.
First, with product-driven channels, the growth of the enterprise must have a clear market positioning and product positioning. It is the only way to open the market with strong products. Second, to improve the brand with cost-effectiveness, companies do not have to be obsessed with branding. , technology, quality, service to meet customer needs; Third, to extend the product line by brand, the company to identify its own market positioning through the advantages of products + services; Fourth, capital integration products and brands, the power of enterprises through capital Do a good job in system marketing integration, provide customers with more value-added services and bring more solutions.
Morning Technology Money Snow: From Material to Solution "The current flip-chip process has four key points: First, material selection, selection of bonding materials according to wafer electrode material and positive and negative electrode spacing; Second, solid crystal operation, adjustment equipment Parameters; Third, the control of welding voids, including wafer back gold thickness, soldering temperature, time and solder paste formulation; Fourth, the residue response, involving no-cleaning and washing," Qian Xuexing said.
For the soldering process of the solid crystal solder paste, Qian Xuexing told everyone that for the packaging of the LED chip, the SnAgCuX alloy solder paste is used as the medium, and the chip and the solderable metal substrate such as gold, silver, tin, etc. are connected by high temperature. Fixing and cooling requirements.
At the same time, Qian Xuexing also mentioned a very important concept, namely fruit powder glue. It is understood that it is a combination of silica gel and phosphor powder to customize the color temperature and the standardized parameters of the index. When controlling the sizing parameters, a dispensing process is performed, which is a hemisphere or a straight shape. Its advantage is that it can achieve the color temperature of the module and the height of the index by the integrated package test.
“The LED flip-chip package uses fruit powder glue, the manufacturing process will become quite simple, and there are few related manufacturing equipments. Except for the solid crystal machine and the reflow furnace, the small equipment is small, and the occupied space is small, so that the LED light source manufacturing automation process height Integration. The next generation of fruit powder glue will be reflowed to make the manufacturing process streamlined and the automation set higher." Qian Xuexing finally mentioned.
Huang Hui-the new poem: Breakthrough Chip Technology Innovation <br> <br> price war with increasing drive current, the current chip inside, light and heat distribution tends to be centralized, high current drive, different product designs will As the temperature difference inside the chip reaches 30 ° C or more, the reliability of the gathering point is greatly reduced, which easily damages the product. Therefore, product technology improvement and innovation are essential to ensure product quality.
"The lower the performance of the luminaire, the higher the cost of the chip, the more the customer pays more attention to the price of the chip. However, as the chip size decreases, the profit margin is lower, and the small size chips on the market are mostly sold at a loss." Huang Huishi said.
Taking 4, 6 inch epitaxy as an example, with the decline of the price of sapphire substrate, the advantages of large-size substrate will gradually appear. It is expected that the share of 4-inch epitaxial wafer will reach 80% or more in the next 2 years. The mosaic, warpage and etch consistency of the 4-inch PSS substrate, as well as the uniformity of 4-inch epitaxial growth, warpage control and yield, are all urgent problems to be solved.
In order to gain market competitiveness, companies are also innovating in technology, but whether new technologies can be truly successful requires enterprise efforts. "New equipment and new technologies are opportunities and challenges for small enterprises. How to take advantage of the advantages of small enterprises to seize opportunities is worth considering." Huang Huishi finally said.
Hilde beans sail: grab the top spot in the sudden emergence of domestic phosphor <br> <br> In recent years, domestic enterprises through continuous development of LED phosphor, increase investment in production, its product quality and performance has been close to or exceeded imports phosphors In addition, the domestic LED phosphors have obvious cost-effective advantages and are constantly occupying the market share of international manufacturers.
"In terms of foreign phosphor brands, especially in the past three years, there has been a significant decline, and the market share of domestic phosphors will become higher and higher in the future." Bean Sails said at the scene.
“At the same time, LED phosphor companies are facing the same standards, patents, talents and capital chains as the packaging companies. I believe that there are several ways to solve this problem: First, focus on quality and brand building; Second, enhance innovation and the introduction of new fluorescent materials; Third, take the cooperation mode of domestic phosphor enterprises in the field of advantages, or cooperate with research institutions and important associations to break through the monopoly of the international giant patent alliance." Dou Fan mentioned.
Huateng semiconductor Zhuowei Huang: EMC test package is the trend <br> <br> packaging technology continues to mature, new technology emerging, EMC package as in recent years the rise of new technology, because of its good performance to be optimistic about a number of packaging companies.
"We expect that the market in 2015, whether it is EMC or EMC supporting products, will show explosive growth." Zhuo Weihuang said.
But like other new technologies, in the initial introduction stage, due to technical, market and cost constraints, only a few LED packaging manufacturers are in trial production. However, with the expansion of market demand and advances in technology, in particular, EMC stent molding materials also have the advantages of high stability against UV, high temperature, and low expansion coefficient. Therefore, bracket manufacturers and backlight markets at home and abroad gradually switch to EMC. Brackets, and this trend has also appeared to a large extent in the lighting market.
In addition, in the production process, many packaging manufacturers shoddy, use secondary recycling materials to fight the price war, completely regardless of product quality, and EMC has no water outlet sales. All kinds of advantages have made EMC's packaging form develop rapidly after its birth, and gradually extended from the initial backlight field to the white light market, and gradually gained market recognition.
Tengsheng Controlled Rubber Lu Guoming: Technology Innovation Drives New Space for Domestic Packaging Equipment “The LED packaging industry has a scale of 12.1 billion yuan in 2013, and is expected to reach more than 14.6 billion yuan in 2014. It is expected to reach 16.7 billion yuan in 2015. At the same time, current technology Packaging companies with obvious advantages in production capacity will benefit from the sharp increase in market demand, and will increase investment in large scale in the future.†Lu Guoming said that the competition between packaging companies will become more intense, so how to reduce costs and increase efficiency will become a solved problem.
Lu Guoming told everyone that the current packaging equipment's dispensing equipment has reached the equipment renewal cycle due to the development needs. Due to the high labor cost, large production line personnel, easy aging, low automation, etc., the dispensing equipment has been unable to adapt. The rapidly changing needs of the current packaging industry, therefore, investment in automated, high-performance fully automatic intelligent packaging dispensing equipment will be the general trend.
“And, the current production capacity of domestically produced equipment is more than 150% higher than that of imported similar equipment. At the same time, domestically produced equipment is slightly higher in automation function configuration than imported similar equipment, and is designed to better meet user needs, and equipment innovation is faster. Lu Guoming mentioned.
It is reported that after catching up in recent years, in addition to the stability of domestic packaging and dispensing equipment, the other indicators have completely replaced or even surpassed imported equipment. And since 2013, including foreign packaging companies CREE, SAMSUNG, LG, SEOUL, domestic listed companies Hongli, Ruifeng, Jufei, Guoxing, etc. have begun testing or using domestic packaging dispensing equipment.
"Therefore, we have reason to believe that with the rapid innovation and improvement of domestically produced equipment, it will lead the current market to a broader development path." Lu Guoming finally mentioned.
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