Those who participated in the 2018 Munich Shanghai Electronics Show in March this year may feel that they have participated in a car technology exhibition. In the past, the booths filled with consumer electronic components have been replaced by automotive electronic components. Domestic and foreign electronics manufacturers have demonstrated the hard power of automotive devices, attempting to “enclose the land as a king†before the explosive growth of automotive electronics. .
In front of the Panasonic Panasonic booth, there is a transparent car model. Panasonic's various automotive components are displayed in different areas of their operation. Counting a total of 9 areas: body control , car entertainment, ETC, high voltage control, battery management, electronic control, lights, general components, tire pressure monitoring. In front of the semi-open booth of Taiwan Semiconductor, it is also a transparent four-seat car, which is showing the circuit protection components of the automotive electronic platform. In addition to the four-seater car, there are also smart motorcycles brought by STMicroelectronics, numerous auto parts and a variety of car-based demonstrations, which constitute the hot scene of this year's Munich electronic station.
Today, OFweek Electronic Engineering Network Xiaobian brings you to eight famous semiconductor exhibitors at home and abroad, and dozens of new automotive semiconductor products launched at the Munich Electronics Show to explore the development direction of automotive electronics.
1. Toshiba's advanced driver assistance system based on VisconTI4 (TMPV7608XBG)
The VisconTITM4 (TMPV7608XBG) series is Toshiba's latest image recognition processor for automotive applications that recognizes lanes, vehicles, pedestrians, traffic signs, etc. through the camera system.
The VisconTITM 4 image recognition processor is equipped with eight media processing engines that support eight applications simultaneously. Compared to the previous generation, the VisconTITM4 processing engine doubles in number and incorporates a new image recognition algorithm. The enhanced CoHOG accelerator is more capable of processing the difference between the object and the background, at night and at low light. Better detect pedestrians under conditions.
2. Renesas smart cockpit solution
The solution uses R-Car H3 embedded virtualization technology, which integrates full LCD virtual instrument, entertainment and air conditioning control, front view and multimedia playback, and ADAS functions on a single chip to drive three screens to realize a software safe operating environment. Functional safety support.
At the same time, Renesas also brought: TTR-Driver look + forward collision warning system - to improve development efficiency by carrying "TTIntegration", provide software and tools to achieve multiple software integration, prototype ECU development focusing on real vehicle evaluation, HAD The platform chassis features aluminum with an IP51 protection rating; the 3D surround vision system controller, the RAS CarV3M's ADAS panoramic view solution suite.
3. ROHM Semiconductor's 2MHz Step-Down DC/DC Converter with Nano Pulse Control
For automotive systems with 48V power supplies such as mild hybrid vehicles, ROHM has developed the industry's highest step-down ratio of the built-in MOSFET step-down DC/DC converter "BD9V100MUF-C" with 2MHz operation (switching). .
The "BD9V100MUF-C" is equipped with the ultra-high-speed pulse control technology "Nano Pulse Control" which combines the advantages of Roma's "circuit design", "layout" and "process" three cutting-edge analog technologies. High voltage input of up to 60V at 2MHz operation It can output a low voltage of 2.52V, and the industry's highest step-down ratio is 24 to 1. This not only enables the miniaturization of peripheral components, but also the high-low voltage conversion structure composed of more than two power ICs. In the past, only one power IC is needed, so that the application can be miniaturized and simplified. .
4. Honeywell AMR Speed ​​and Direction Sensor Platform Chip
Honeywell's VM421D1/VM821Q1/VM721V1/VM721D1 series of new anisotropic magnetoresistive (AMR) speed direction sensor platform chips with a unique AMR magnetoresistive bridge design for accurate detection of targets with ring magnet encoder targets And direction. Applicable to gearbox output shaft speed/direction detection, engine crankshaft speed measurement, ABS wheel speed detection, bearing speed direction detection, and shaft/speed detection of pump/motor/compressor. The new high-performance AMR sensor chip enables low noise and higher magnetic field inspiration. Insensitive to sudden changes in the air gap of the target detector, the air gap between the top of the sensor and the measuring object is larger, allowing for greater mounting tolerances and reducing installation costs, without the need for additional EMC protection capacitors, and passing the AECQ100-H vehicle specification.
5. Fujitsu FRAM (ferroelectric random access memory) solution
This program is mainly used in advanced driver assistance systems, car entertainment, human-computer interaction, intelligent battery management systems and system integration technologies. FRAM devices operate at high temperatures up to 125 ° C and are compliant with the automotive industry AEC Q100 standard. Because FRAM is a non-lost memory, it not only enables high-speed random access, but also has high write-resistant characteristics, which can store the data collected by the sensor reliably and without delay. Currently, FRAM devices support real-time and continuous data storage in applications such as airbag data storage, accident data loggers (EDR), battery management systems (BMS), automotive driver assistance systems, and navigation and infotainment services. Reduce system complexity and improve data integrity.
6. Bosch MEMS sensor
Originally used in automotive safety systems, it was used extensively in various parts of the car. Currently, it mainly includes airbag systems, body stability control systems, active suspension systems, engine management systems, transmission control systems, and car networking and infotainment systems.
7. Taiwan Semiconductor Single Channel Highly Integrated Dimmable Car Headlight LED Driver Control - TS1950CB10
TS1950CB10 is a half-channel single-channel low-side current-sensing LED driver chip. The chip can work in discontinuous mode, zero-conduction mode and continuous mode, and has a comprehensive protection mechanism. This driver chip is designed for automotive headlight LED drivers.
Typical topologies supported by the TS1950CB10 are boost converters and buck converters. A control loop is designed based on the average current mode to adjust the output current. The fault detection pin is externally connected to a pull-up resistor for VIN. When the output fault occurs, the timer automatically detects the latch fault state.
Features: Suitable for -40 ° C to 125 ° C ambient temperature, input voltage range of 4.5V-38V, output voltage range of 6V-60V, switching frequency adjustable 70k-700kHz, low-side current sampling, internal reference voltage 150mV ± 2%, fault Error reporting, integrated PWM and analog dimming, overvoltage protection, overcurrent protection, overtemperature protection, undervoltage lockout.
8. Shenzhen BYD Microelectronics 215 pinfin module
BYD's automotive grade IGBT modules have attracted industry attention as soon as they are available. The packaging technology and product quality of the BYD module have been verified and affirmed by the market.
The 215 pinfin module is an IGBT module for new energy vehicles that was introduced by BYD Microelectronics 2018. Advantages: The package test is compatible with the same type of products in the market, and the customer can directly replace it; the most advanced chip technology is used to ensure the module performance advantage; the bottom plate adopts AlSiC material and the unique pinfin structure is more conducive to heat dissipation and improve the reliability of the module; The products are applied to A0 class and A00 class models, and need to provide more cost-effective core components for micro electric vehicles.
summaryObviously, automotive semiconductors have become the focus of the market. The future trend of intelligence, networking and electrification is making the car become a computer with four wheels; and the car chip and computing power provider will also become the core position of the smart car industry. The market is opening up, are you ready for the profound changes in the automotive industry?
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