Some assessments show that only 20%-30% of smt production lines worldwide are equipped with automated optical inspection (aoi) systems. Although the size of the device has shrunk beyond the reach of the human eye in recent years, and aoi has shown some attractive performance, the market remains skeptical about its value. In response to market conditions, detection technology is now evolving toward a more filial and faster verification principle. Epv (Inline Detection) is an emerging technology that will test the technology's embedded device's operating procedures and answer questions such as peripheral costs, floor space and rate of return that assemblers are concerned about.
Verification in embedded production processes Aoi industry insiders have seen the prospect of deploying multiple on-line inspection systems on each production line: 100% inspection after layout printing, device placement and reflow. Immediately after each process, solder paste errors, missing device placements or errors, bad solder joints, etc., can be detected, which can reduce waste and allow some boards to be sent back to redo, resulting in less additional cost for scrapping boards. This strategy works well in some markets, but many assemblers are reluctant to accept additional capital investment and a larger production line footprint. In addition, the workload of its production cycle, personnel training and equipment programming is also large. However, some companies require very strict testing, convinced that every process must be under control to minimize errors, so that the cost of the last few inevitable scrap boards is acceptable.
But the assembler still wants to limit solder paste printing errors and incorrect device placement -- two of the most important reasons for the board's technical board scrapping before reflow.
Cyberopts has developed an verification (epv) solution embedded in the production process. Cyberoptics is an expert in optical technology and has a long-standing reputation for providing smt assembly equipment and assembly markets with tools to increase production capacity. Cyberoptics' new epv technology allows visual inspection capabilities to be added to the placement machine while the device is being placed. In this way, the system can have a lower price, with little or no additional cycle time, and without increasing the footprint of the production line. But all of this needs to be supported by the equipment manufacturer.
Universal Instruments is the first equipment manufacturer to focus on epv potential and invest in research in this technology. Currently, Universal Instruments offers this technology as an option for the genesis and advantis platforms, along with Universal Instruments' lightning heads. Universal Instruments President iandesouza believes that this will be one of the most exciting innovations in the industry in the next decade.
Work at the same time as the placement process
Because epv is placed directly inside the device, it can continuously provide instant program data without increasing cycle time and additional programming overhead. When it is implanted with a genesis or advantis machine with a lightning head, it will work while the placement process is running, not later. This is also the technology that the market has long pursued.
The cyberoptics chairman and founder Steveneven further clarified that epv provides a broader view of the equipment operation than any previous assembler can achieve. Importantly, it can reduce the time required to return to normal production after an emergency such as changing a process, and reduce the likelihood of uncertainty.
In pick and place devices, the epv sensor captures the information of each component in a unique way and transmits the data to the host via firewire. Operators and process engineers can also review each real-time information and archive information in detail using epv software. Information on the host can be exported to a public directory for archival or for access by other network terminals.
Cyberoptics overcomes many tough technical challenges for implementing epv. The system has a highly miniaturized mechanical and optical system that can be moved into the narrow space of the advantis or genesis. Data acquisition time and fast image processing are critical to complete a complete verification job within one setup time. Cyberoptics found that accurate graphics are very important for the most reliable information. After solving these problems, the development team established a stable solution based on performance indicators, and cyberoptics and Universal Instruments ushered in the first breakthrough. The two companies work together to integrate the epv sensor with the lightning heads of genesis and advantis.
Smt one-time pass rate will be higher
Through the above work, we obtained a system with high-definition real-time placement images and 100% automatic detection of missing devices. In addition, the epv solution allows engineers to review placement images to verify solder paste quality, identify deviations, errors and misplaced devices, and inspect new nozzles - an enhancement that provides the root cause The ability to analyze errors. In the near future, epv will also add the same performance to the device picking process.
The software combines the epv sensor system, the motor control system of the equipment and the placement head with the production program, eliminating the need for epv programming and training time. The epv has no effect on the speed of the device up to 60,000 cph, which allows the epv to be fully integrated with the fast double-headed genesis head without affecting the duty cycle.
Online aoi exceeds epv in full detection capability. However, epv has an advantage in quickly judging the go/no-go signal of each board and providing other intelligent functions. And, most importantly, the cost of epv is lower.
Universal Instruments and cyberoptics have confirmed the concept that effective optical inspection can be implanted in certain placement platforms, breaking the technical bottleneck of using a wide range of automated inspections. Epv meets the performance requirements of most aoi buyers, and its low price makes inspection technology more acceptable in the wider market. Epv will be the catalyst for process monitoring technology in a wide range of assembly lines.
Finally, since epv can correct the detected defects while the board is still in the placement machine, we can expect a one-time pass rate will be higher in the future smt line.
Verification in embedded production processes Aoi industry insiders have seen the prospect of deploying multiple on-line inspection systems on each production line: 100% inspection after layout printing, device placement and reflow. Immediately after each process, solder paste errors, missing device placements or errors, bad solder joints, etc., can be detected, which can reduce waste and allow some boards to be sent back to redo, resulting in less additional cost for scrapping boards. This strategy works well in some markets, but many assemblers are reluctant to accept additional capital investment and a larger production line footprint. In addition, the workload of its production cycle, personnel training and equipment programming is also large. However, some companies require very strict testing, convinced that every process must be under control to minimize errors, so that the cost of the last few inevitable scrap boards is acceptable.
But the assembler still wants to limit solder paste printing errors and incorrect device placement -- two of the most important reasons for the board's technical board scrapping before reflow.
Cyberopts has developed an verification (epv) solution embedded in the production process. Cyberoptics is an expert in optical technology and has a long-standing reputation for providing smt assembly equipment and assembly markets with tools to increase production capacity. Cyberoptics' new epv technology allows visual inspection capabilities to be added to the placement machine while the device is being placed. In this way, the system can have a lower price, with little or no additional cycle time, and without increasing the footprint of the production line. But all of this needs to be supported by the equipment manufacturer.
Universal Instruments is the first equipment manufacturer to focus on epv potential and invest in research in this technology. Currently, Universal Instruments offers this technology as an option for the genesis and advantis platforms, along with Universal Instruments' lightning heads. Universal Instruments President iandesouza believes that this will be one of the most exciting innovations in the industry in the next decade.
Work at the same time as the placement process
Because epv is placed directly inside the device, it can continuously provide instant program data without increasing cycle time and additional programming overhead. When it is implanted with a genesis or advantis machine with a lightning head, it will work while the placement process is running, not later. This is also the technology that the market has long pursued.
The cyberoptics chairman and founder Steveneven further clarified that epv provides a broader view of the equipment operation than any previous assembler can achieve. Importantly, it can reduce the time required to return to normal production after an emergency such as changing a process, and reduce the likelihood of uncertainty.
In pick and place devices, the epv sensor captures the information of each component in a unique way and transmits the data to the host via firewire. Operators and process engineers can also review each real-time information and archive information in detail using epv software. Information on the host can be exported to a public directory for archival or for access by other network terminals.
Cyberoptics overcomes many tough technical challenges for implementing epv. The system has a highly miniaturized mechanical and optical system that can be moved into the narrow space of the advantis or genesis. Data acquisition time and fast image processing are critical to complete a complete verification job within one setup time. Cyberoptics found that accurate graphics are very important for the most reliable information. After solving these problems, the development team established a stable solution based on performance indicators, and cyberoptics and Universal Instruments ushered in the first breakthrough. The two companies work together to integrate the epv sensor with the lightning heads of genesis and advantis.
Smt one-time pass rate will be higher
Through the above work, we obtained a system with high-definition real-time placement images and 100% automatic detection of missing devices. In addition, the epv solution allows engineers to review placement images to verify solder paste quality, identify deviations, errors and misplaced devices, and inspect new nozzles - an enhancement that provides the root cause The ability to analyze errors. In the near future, epv will also add the same performance to the device picking process.
The software combines the epv sensor system, the motor control system of the equipment and the placement head with the production program, eliminating the need for epv programming and training time. The epv has no effect on the speed of the device up to 60,000 cph, which allows the epv to be fully integrated with the fast double-headed genesis head without affecting the duty cycle.
Online aoi exceeds epv in full detection capability. However, epv has an advantage in quickly judging the go/no-go signal of each board and providing other intelligent functions. And, most importantly, the cost of epv is lower.
Universal Instruments and cyberoptics have confirmed the concept that effective optical inspection can be implanted in certain placement platforms, breaking the technical bottleneck of using a wide range of automated inspections. Epv meets the performance requirements of most aoi buyers, and its low price makes inspection technology more acceptable in the wider market. Epv will be the catalyst for process monitoring technology in a wide range of assembly lines.
Finally, since epv can correct the detected defects while the board is still in the placement machine, we can expect a one-time pass rate will be higher in the future smt line.
Displacement sensor, also known as linear sensor, is a linear device belonging to metal induction. The function of the sensor is to convert various measured physical quantities into electricity. In the production process, the measurement of displacement is generally divided into measuring the physical size and mechanical displacement. According to the different forms of the measured variable, the displacement sensor can be divided into two types: analog and digital. The analog type can be divided into two types: physical property type and structural type. Commonly used displacement sensors are mostly analog structures, including potentiometer-type displacement sensors, inductive displacement sensors, self-aligning machines, capacitive displacement sensors, eddy current displacement sensors, Hall-type displacement sensors, etc. An important advantage of the digital displacement sensor is that it is convenient to send the signal directly into the computer system. This kind of sensor is developing rapidly, and its application is increasingly widespread.
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